Die Attach
Die attach materials and processes are critical in microelectronic assembly, impacting die stress, functionality, thermal management, and reliability. Proper die attach methods optimize the mechanical attachment of the die to the substrate, establish a thermal path, and create an electrical connection for the ground plane.
Stainless Steel Precision Tips: Provide accurate and consistent application of die attach materials, ensuring strong mechanical and thermal bonds.
Under Fill
Underfill is essential in interconnect devices like BGAs and flip chips, compensating for thermal expansion differences between the chip and the interconnect device. This significantly enhances the reliability and service life of the components.
Tapered Tips: Ideal for dispensing underfill materials to ensure a smooth and even flow into tight spaces and under components.
Flexible Tips: Help reach under components and into small gaps, providing complete coverage.
Dam and Fill
Dam and fill is a two-step process used to fully encapsulate wire-bonded dies. First, a dam is dispensed around the component's periphery, followed by filling the center. This method ensures complete encapsulation and protection.
Dam Tips
Needle Tips: Provide precise control for creating the initial dam around the periphery of the component.
Bent or Angled Tips: Useful for applying the dam in hard-to-reach areas or around irregular shapes.
Fill Tips
Tapered Tips: Ensure smooth and even filling of the center area after the dam is applied, preventing air bubbles and ensuring complete encapsulation.
Flexible Tips: Adapt to the varying depths and shapes within the dammed area for thorough filling.
Bonding
Bonding joins two or more components without introducing heat, preventing potential damage. In plastic parts, surface activation through atmospheric or low-pressure plasma maintains the surface and material integrity, preserving mechanical, aerodynamic, and aesthetic properties.
Bent or Angled Tips: Allow precise application in hard-to-reach areas and on complex geometries.
Brush Tips: Useful for spreading bonding agents evenly across surfaces.
Gasketing
Gasket dispensing efficiently seals housing covers, protecting electrical components from moisture, dust, air, and other contaminants. This process enhances product safety, security, and functionality.
Oval Tips: Create flat ribbon deposits ideal for forming consistent gaskets.
Tapered Tips: Provide smooth, even application to form effective seals.
Lubrication
Lubrication methods vary based on the volume of parts. Small volumes can be manually greased or oiled, while larger volumes benefit from automated dispensing systems for efficient and consistent application.
Brush Tips: Perfect for manually applying grease or lubricant evenly over surfaces.
Flexible Tips: Useful for reaching difficult areas where precise lubrication is required.
Thermal Compounds
Thermal compounds, or pastes, are used in high-tech applications requiring superior thermal conductivity, such as telecom, military, and medical fields. These compounds ensure optimal interface between processors and heatsinks and can be dispensed manually or with digitally controlled systems.
Tapered Tips: Ensure even distribution of thermal paste, accommodating the topography of processors and heatsinks.
Stainless Steel Tips: Provide precision in applying high-viscosity thermal compounds.
Lid Seal
Lid seal adhesives meet the rigorous demands of semiconductor packaging, providing excellent adhesion to various substrates and performing reliably under high temperatures and fast curing processes. They excel in reliability tests like temperature cycling and moisture sensitivity.
Precision Tips: Ensure accurate application of lid seal adhesives for semiconductor packaging.
Tapered Tips: Provide controlled flow and placement of sealants.
Painting
Painting and coating involve multiple operations before and after the actual coating process, ensuring a high-quality finish and protection for the components.
Brush Tips:
Ideal for spreading paints and coatings evenly across surfaces.
Ensures smooth application and consistent coverage in painting and coating processes.
Spray Tips:
Suitable for automated systems, allowing for uniform and controlled spraying of paint or coatings.
Provides fine atomization for a smooth finish.
Tapered Tips:
Useful for detailed work, allowing precise application of paint or coatings in specific areas or on intricate components.
Chip Encapsulation
Chip encapsulation uses adhesives to protect smart card chips from breakage, scratching, dust, and moisture. These solvent-free adhesives with high ionic purity also prevent internal corrosion and reduce voltaic coupling.
Needle Tips:Allow precise placement of encapsulants to protect chip components from environmental factors.
Brush Tips: Useful for spreading encapsulants evenly over chip surfaces.
Solder Paste
Solder paste is crucial for surface mount boards, applied before pick and place processes. When passed through an infra-red reflow machine, it melts to create secure soldered joints.
Stainless Steel Tips: Ensure precise application of solder paste on surface mount boards, essential for creating reliable solder joints.
Needle Tips: Provide controlled dispensing of small, consistent amounts of solder paste.
Conductive Adhesives
Electrically conductive adhesives are lead-free solder alternatives for attaching active and passive components, used in high-reliability applications such as aerospace, automotive, medical, and telecom industries.
Precision Tips: Allow for exact placement of conductive adhesives, crucial for maintaining electrical connectivity in high-reliability applications.
Needle Tips: Provide fine control for small, detailed applications.
Solder Mask
Solder mask, or solder resist, is a thin polymer layer applied to PCB copper traces to protect against oxidation and prevent solder bridges between closely spaced pads.
Tapered Tips: Ensure even coverage and smooth application of solder mask to protect PCB traces.
Flexible Tips: Reach tight and intricate areas on the PCB.
Cavity Fill
Cavity packages offer a simple packaging method for devices like integrated circuits and MEMS. Cavity filling provides essential protection for these components.
Needle Tips: Deliver precise amounts of fill material into cavities, ensuring complete protection for packaged devices.
Flexible Tips: Adapt to various shapes and sizes of cavities for thorough filling.
SMT Adhesives
SMT adhesives secure components to PCB during wave soldering or double-sided reflow processes, ensuring stability and precision in surface-mount assemblies.
Stainless Steel Tips: Provide accurate placement of SMT adhesives to secure components on PCB during soldering.
Needle Tips: Offer fine control for small-scale applications and detailed work.
Chip-Scale Package (CSP)
A chip-scale package (CSP) is a compact integrated circuit package that offers high performance and reliability.
Needle Tips: Provide fine control for the precise application of adhesives and encapsulants around small CSPs.
Ensures accurate placement and minimizes waste.
Stainless Steel Tips: Ensure consistent and reliable application of materials used in CSP assembly.
Durable and compatible with a wide range of materials.
Flexible Tips: Adapt to the small and often complex geometries of CSPs, ensuring complete coverage and adhesion.
Suitable for dispensing underfill and encapsulants in tight spaces.
Sealing
Sealing involves joining materials with a sealant that adheres to surfaces, transferring forces between adherents. Sealants are crucial for creating secure and durable joints.
Tapered Tips: Ensure a smooth, consistent application of sealants, crucial for creating durable and effective seals.
Brush Tips: Useful for spreading sealants evenly across surfaces to be joined.